Original ZM-R5860 Air BGA Rework Station Soldering Machine Zhuomao 3 Zones 4800W 220V for Laptop Chip Game Consoles Repair

Original ZM-R5860 Hot Air BGA Rework Station Soldering Machine Zhuomao 3 Zones 4800W 220V for Laptop Chip Game Consoles Repair

Parameter

1. Total Power: 4800W

2. Top heater: 800W

3. Bottom heater: 2nd heater 1200W，3rd IR heater 2700W

4. Power supply: AC220V±10％ 50/60Hz

5. Dimension: 635×620×655mm

6. Positioning: V-groove, PCB support can be adjusted in any direction with external universal fixture

7. Temperature control: (K Sensor) closed loop, independent heating, precision within ±3°c.

8. PCB size: Max 415×370mm, Min 10x10mm.

9. Chip size: Max 40x40mm, Min 10x10mm.

10. Preheating area: 285x375mm.

11. Display: HD touch screen.

12. Electrical selection: Highly sensitive temperature control module＋Touch screen (Taiwan)+Delta PLC

13. Net Weight: 43.5KG

Feature

1- Adopt liner slide which makes X- Y- Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability；

2- high definition touch screen (Taiwan) , PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function；

3- There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ±3 °; Top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time; the third IR heater can be adjusted the power consumption;

4- Offer all kinds of hot-air nozzle, it can rotate 360°；With magnet, easy to install and change, customized is available; Bottom IR heater ensure an even heat for PCB board;

5 - Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size;

7- powerful cross-flow fan rapidly cool the PCB board to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly；

8.After finishing desoldering & soldering, There is an alarming and alarming in advance；

9- CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens；with a double over-heating protection control；